High Quality Breadboard 400-Hole Breadboard Electronic

About Iitem

• Model: 400-hole breadboard
• Mechanical rigidity: rigid
• Number of layers: single side
• Substrate: Copper
• Insulation material: organic resin
• Insulation thickness: conventional board
• Insulation resin: epoxy resin (EP)
• Product Name: Solderless Breadboard
• Product Model: BB-801
• Product size: 5.5×8.2×0.85cm
• Number of product holes: 400 holes
• 1: Suitable for circuit prototyping,
• 2: ABS plastic panel, tin-plated phosphor bronze contact piece
• 3: Can be used with 20-29AWG wire
• 4: Voltage/Current: 300V/3-5A